Embedded Systems

clIent CHALLENGES

 

• Better and smaller designs with new features, technologies and improved usability
• Faster go-to-market
• Reduced costs
• Development of eco-friendly products that adhere to stringent compliance standards
• Availability of modular and reusable components for easy scalability, enhancements and localization 

WHAT TCS PROVIDES

We have capabilities across the product technology stack of digital, analog, mixed-signal and RF products. Our NPD services encompass the entire product lifecycle, from ideation and requirements formalization to design and prototyping and then sustenance engineering. Our services include the following:

• Formal and verifiable requirements capturing, coupled with modeling and simulation to ensure that the marketing requirements are stated unambiguously
• Architectural definition including hardware / software system partitioning
• VLSI design and verification that includes ASIC, FPGA, CPLD and SoC
• Micro processor and DSP-based designs
• Circuit design and PCB development and bring up complex boards up to 22 layers and over 3,000 components
• Firmware that includes boot loaders, drivers and protocol stacks
• Middleware components
• Software applications and utilities for device management, configuration, monitoring and diagnostics
• GUI and HMI design
• Device and platform connectivity solutions including communication protocols, security and data transfer components
• Independent V&V services like design verification, hardware / software testing and qualification test services like environmental, EMI / EMC and (H)ALT

We take complete ownership of your design besides providing contract manufacturing and spares management services.

Leveraging our DDD&V capabilities, we offer Product Sustenance services that include the following: 

• Value engineering to optimize product BoM and / or design from a cost perspective
• Obsolescence management to replace obsolescent or non-available parts of a product BoM
• RoHS compliance to replace non-compliant parts in a product BoM
• Reverse and re-engineering to facilitate compliance, product documentation and upgrades / enhancements

Business Value

 

• Global Network Delivery Model™ (GNDM™) for global reach and cost advantage
• Key alliances in materials research, product testing and certification support
• Captive Centers of Excellence (CoEs) in technology and application domains
• Mature processes for project management, engagement management, account relationships and support functions
• A global embedded engineering pool of 1,500 people

Alliances

AUTOSAR, JasPar, Intel, Qualcore Logic, Xilinx, Ethercat Technology Group, Wimax Forum, Mechatronix, CC link, 3GPP2, Open silicon