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Where adaptability meets advantage

At TCS, we don’t just help businesses transform. We help them become perpetually adaptive enterprises, built to evolve continuously and confidently in a world of constant change.

Adaptability starts here
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Where adaptability meets advantage
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    • TCS ADD™
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    • ignio™
    • TCS iON™
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  • We deliver excellence and create value for customers and communities.

    Our expert, committed team put our shared values into action – every day. With the best talent and the latest technology we help customers turn complexity into opportunities and create meaningful change.

    Discover the difference
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    We deliver excellence and create value for customers and communities.
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    We are a digital transformation and technology partner of choice for industry-leading organizations worldwide.

    Read our customer success stories.
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    Upcoming events

    27 Dec 2025 TCS at Guidewire Connections 2025
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    Recent recognitions

    15 Oct 2025 From Technical Liability to Digital Dominance: Plaza Premium Group’s Bold Transformation
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    18 Sep 2025 Emirates NBD Transforms Payments and Reengineers Banking Operations
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    What we do

    Where adaptability meets advantage

    At TCS, we don’t just help businesses transform. We help them become perpetually adaptive enterprises, built to evolve continuously and confidently in a world of constant change.

    Adaptability starts here
    • Industries
    • Services
    • Products and Platforms
    • Research & Innovation
    • Alliances
    • Banking
    • Capital Markets
    • Consumer Packaged Goods and Distribution
    • Communications, Media, and Information Services
    • Education
    • Energy, Resources, and Utilities
    • Healthcare
    • High Tech
    • Insurance
    • Life Sciences
    • Manufacturing
    • Public Services
    • Retail
    • Travel and Logistics
    • Artificial Intelligence and Data & Analytics
    • Cloud
    • Cognitive Business Operations
    • Consulting
    • Cybersecurity
    • Enterprise Solutions
    • IoT and Digital Engineering
    • Network Solutions and Services
    • TCS Interactive
    • Sustainability Services
    • TCS ADD™
    • TCS BANCS™
    • TCS BFSI Platforms
    • TCS CHROMA™
    • TCS Customer Intelligence & Insights™
    • TCS ERP on Cloud
    • ignio™
    • TCS iON™
    • TCS HOBS™
    • TCS Intelligent Urban Exchange™
    • TCS OmniStore™
    • TCS Optumera™
    • TCS Tap™
    • Quartz™ – The Smart Ledgers™
    • TCS TwinX™
    • TCS MasterCraft™
    • Jile™
    • TCS DigiBOLT™
    • TCS AI WisdomNext™
    • TCS Research
    • TCS Pace™
    Where adaptability meets advantage
  • Industries expand here
    • Banking
    • Capital Markets
    • Consumer Packaged Goods and Distribution
    • Communications, Media, and Information Services
    • Education
    • Energy, Resources, and Utilities
    • Healthcare
    • High Tech
    • Insurance
    • Life Sciences
    • Manufacturing
    • Public Services
    • Retail
    • Travel and Logistics
  • Services expand here
    • Artificial Intelligence and Data & Analytics
    • Cloud
    • Cognitive Business Operations
    • Consulting
    • Cybersecurity
    • Enterprise Solutions
    • IoT and Digital Engineering
    • Network Solutions and Services
    • TCS Interactive
    • Sustainability Services
  • Products and Platforms expand here
    • TCS ADD™
    • TCS BANCS™
    • TCS BFSI Platforms
    • TCS CHROMA™
    • TCS Customer Intelligence & Insights™
    • TCS ERP on Cloud
    • ignio™
    • TCS iON™
    • TCS HOBS™
    • TCS Intelligent Urban Exchange™
    • TCS OmniStore™
    • TCS Optumera™
    • TCS Tap™
    • Quartz™ – The Smart Ledgers™
    • TCS TwinX™
    • TCS MasterCraft™
    • Jile™
    • TCS DigiBOLT™
    • TCS AI WisdomNext™
  • Research & Innovation expand here
    • TCS Research
    • TCS Pace™
  • Alliances
  • Who we are

    We deliver excellence and create value for customers and communities.

    Our expert, committed team put our shared values into action – every day. With the best talent and the latest technology we help customers turn complexity into opportunities and create meaningful change.

    Discover the difference
    • Brand
    • Leadership
    • Community
    • Sustainability
    • Inclusion
    • Values
    We deliver excellence and create value for customers and communities.
  • Brand
  • Leadership
  • Community
  • Sustainability
  • Inclusion
  • Values
  • Insights

    Discover why customers choose TCS

    We are a digital transformation and technology partner of choice for industry-leading organizations worldwide.

    Read our customer success stories.
    • Events
    • Analyst Recognition
    • Global Studies

    Upcoming events

    27 Dec 2025 TCS at Guidewire Connections 2025
    01 Dec 2025 TCS at AWS re:Invent 2025
    18 Nov 2025 TCS is a Gamechanger Sponsor of Microsoft Ignite 2025
    View all

    Recent recognitions

    15 Oct 2025 From Technical Liability to Digital Dominance: Plaza Premium Group’s Bold Transformation
    06 Oct 2025 Unlocking the Future: 6G & AI for Telcos
    18 Sep 2025 Emirates NBD Transforms Payments and Reengineers Banking Operations
    View all
    Discover why customers choose TCS
  • Events
  • Analyst Recognition
  • Global Studies
  • Careers

    Want to be a global change-maker? Join our team.

    At TCS, we believe exceptional work begins with hiring, celebrating and nurturing the best people — from all walks of life.

    Join us
    • India
    • Americas
    • Asia Pacific
    • Europe and UK
    • Middle East and Africa
    • India
    • Argentina
    • Brazil
    • Canada
    • Chile
    • Colombia
    • Ecuador
    • Mexico
    • Peru
    • Uruguay
    • USA
    • Australia
    • Mainland China
    • Hong Kong SAR
    • Indonesia
    • Japan
    • Malaysia
    • New Zealand
    • Philippines
    • Republic of Korea
    • Singapore
    • Chinese Taipei
    • Thailand
    • Belgium
    • Denmark
    • Estonia
    • Finland
    • France
    • Germany
    • Hungary
    • Ireland
    • Italy
    • Luxembourg
    • Netherlands
    • Norway
    • Poland
    • Portugal
    • Spain
    • Sweden
    • Switzerland
    • United Kingdom
    • Bahrain
    • Israel
    • Kuwait
    • Qatar
    • Saudi Arabia
    • South Africa
    • United Arab Emirates
    Want to be a global change-maker? Join our team.
  • India expand here
    • India
  • Americas expand here
    • Argentina
    • Brazil
    • Canada
    • Chile
    • Colombia
    • Ecuador
    • Mexico
    • Peru
    • Uruguay
    • USA
  • Asia Pacific expand here
    • Australia
    • Mainland China
    • Hong Kong SAR
    • Indonesia
    • Japan
    • Malaysia
    • New Zealand
    • Philippines
    • Republic of Korea
    • Singapore
    • Chinese Taipei
    • Thailand
  • Europe and UK expand here
    • Belgium
    • Denmark
    • Estonia
    • Finland
    • France
    • Germany
    • Hungary
    • Ireland
    • Italy
    • Luxembourg
    • Netherlands
    • Norway
    • Poland
    • Portugal
    • Spain
    • Sweden
    • Switzerland
    • United Kingdom
  • Middle East and Africa expand here
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    • Israel
    • Kuwait
    • Qatar
    • Saudi Arabia
    • South Africa
    • United Arab Emirates
  • Newsroom

    Find the latest news about TCS

    Stay up-to-date on all press announcements by TCS

    Discover more
    • News Alerts
    • Media Kit

    Recent News

    16 Oct 2025 TCS and Infineon Partner to Redefine Digital Experience and Accelerate Sales Growth
    16 Oct 2025 NCVET Selected TCS to Develop a Portal Aimed at Democratizing the Vocational Skill Development Ecosystem in India
    19 Sep 2025 TCS Interactive Opens Flagship Studio in New York City to Drive Innovation-led Experiences
    View all
    Find the latest news about TCS
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    Tata Consultancy Services Limited
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    Discover more Q1FY26 Debrief
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    • High Tech
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    TCS NextGen Chip Engineering Services

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    HIGHLIGHTS

    • Semiconductor chips are the backbone of modern technology, powering devices and systems, revolutionizing the way we live, societies function, and enterprises operate.
    • To meet diverse industry needs and to keep up with the complexity of designing next-generation integrated circuits (ICs), semiconductor companies need an ‘innovation first’ approach. 
    • TCS’ NextGen Chip Engineering Services provide expertise across the entire IC design cycle, from silicon implementation to advanced package design (APD), accelerating tapeout for next-generation chips.  

    On this page

    Overview   inpage
    Solution   inpage
    Benefits   inpage
    The TCS advantage   inpage
    Overview inpage
    Solution inpage
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    Overview Solution Benefits The TCS advantage

    Overview

    Semiconductor chips are at the core of a digital future.

    To stand out in a competitive market, semiconductor companies must keep pace with the rapidly evolving needs of technologies like artificial intelligence (AI), IoT, 5G, cloud, and high performing computing (HPC). 

    Meeting the diverse power and performance requirements across industries with accelerated time to market, requires rapid adoption of new silicon technologies, such as multi-die chiplets or advanced technology nodes.

    TCS NextGen Chip Engineering Services draws on our experience in advanced silicon technologies, cross-domain expertise, and commitment to first-time-right delivery. 

    Solution

    TCS’ technology innovation potential and product engineering expertise enable its customers in silicon engineering from concept to tapeout.

    TCS NextGen Chip Engineering Services are backed by efficient design methodologies and deep domain expertise to address complex design challenges and reduce the time to market.

    With comprehensive capabilities in digital IC design, we provide world-class expertise across the entire design cycle, which includes silicon implementation and advanced package design (see Figure 1). 

    End-to-end silicon engineering capabilities

    This illustration breaks down TCS’ comprehensive technology innovation and product engineering expertise which enables its customers to leverage silicon engineering from concept to tapeout. TCS provides end-to-end silicon engineering capabilities including logical design, high-level synthesis and verification, field programmable gate array (FPGA) prototyping and emulation, design for test implementation and integration, physical design, advanced package design, computer-aided design (CAD) flow and methodology accompanied with reusable assets developed optimizing decades of rich silicon engineering expertise.

    End-to-end silicon engineering capabilities

    Figure 1:

    Close
    End-to-end silicon engineering capabilities
    End-to-end silicon engineering capabilities


    With silicon implementation, TCS can:

    • Create efficient logical designs across Verilog, SystemVerilog and VHDL, with expertise in complex system on chip (SoC) integration, and high-speed protocols such as universal chiplet interconnect express™ (UCIe™), peripheral component interconnect express (PCIe), and compute express link (CXL).
    • Design verification (DV) employing advanced verification methodologies such as universal verification methodology (UVM), to ensure code and functional coverage, performance validation, formal verification.
    • Emulate testing on actual silicon with rapid iterative design validation using field programmable gate array (FPGA) prototyping.
    • Transform logic design through the process of synthesis, floor planning, power planning, partitioning, placement, routing, static timing analysis (STA), and physical verification, creating an optimal physical design that combines power, performance, area, and timing requirements.
    • Implement and integrate design-for-test (DFT) to enhance testability of silicon designs with scan insertion and test pattern generation, memory built-in self-test (BIST) logic insertion and verification, and joint test action group (JTAG) or boundary scan insertion.
    • Achieve energy efficiency using low-power design expertise, including implementing power-gating and Adaptive voltage scaling (AVS).
    • Implement design methodologies and computer-aided design (CAD) flow automation with advanced scripting, such as transaction control language (TCL) and Python to maximize reuse across design teams.
    • Develop RISC-V based custom subsystems, SoCs and systems with expertise across instruction set architecture (ISA) customization, core configuration and integration, RISC-V compliance and verification, and firmware and compiler development.

    With advanced package design, TCS can: 

    • Integrate and verify die-to-die (D2D) subsystems in system-on-chips (SoCs) based on UCIe™ and high bandwidth memory (HBM) interface specifications required to create futuristic chiplet-based multi-die systems.
    • Co-design 2.5D and 3D interposers and multi-layer organic substrates to create advanced package designs with improved signal integrity, lower latency, and reduced footprint.
    • Implement and integrate IEEE 1838 test access logic for integrated circuits in 2.5D and stacked-die packages to perform signal integrity and power integrity analyses, ensuring high data transfer quality.

    Benefits

    TCS’ services enable semiconductor companies to accelerate the tapeout of next-generation chips, secure critical design wins, and gain market leadership.

    Using our services, companies can benefit from:

    Rapid adoption of advanced silicon technologies: This will allow companies to tapeout next-generation devices based on chiplet architecture with expertise in advanced package design and UCIe™.

    Cost optimization: Enterprises can customize chips and reduce the costs by using RISC-V ISA across peripherals, cores, and SoCs.  

    Product differentiation: Leverage TCS’ comprehensive silicon engineering capabilities coupled with industry and domain expertise across AI, automotive, communications, IoT, HPC to tapeout new and derivative chips.

    Faster time to market: Backed by unique verification solutions, TCS’ offering will help semiconductor companies ensure first-time-right products based on advanced verification methodologies such as UVM and formal verification.

    The TCS advantage

    TCS has over three decades of experience and domain expertise in the semiconductor industry, with its collaboration-partner ecosystem enabling product engineering from chip to system.

    TCS has deep domain expertise across the product development lifecycle, from concept to chip to systems, from design and market readiness to systems integration, deployment, and sustenance.

    We specialize in developing custom chipsets across sectors such as automotive, communications, and consumer and industrial electronics.  With experience in handling advanced technology nodes and developing solutions across emerging technology areas such as neuromorphic computing, quantum computing, processor-in-memory, advance packaging, our capabilities allow customers to co-design and deliver next-generation processing solutions.

    Strategic partnerships with startups, academia, foundry, and co-innovation (TCS COIN™) partners, as well as our partner-collaboration ecosystem allow us to create differentiated solutions across the value chain, leading to new revenue streams for our customers.

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