January 6-9, 2026 | Las Vegas, NV
TCS at CES 2026
Engineering the future Intelligent by design
Industry
Manufacturing
Future-Ready Manufacturing: Partnering in your journey to a sustainable manufacturing enterprise
High Tech
High Tech Solutions to Drive Business Transformation through Technology
Services
IoT and Digital Engineering
Bringing Together IoT and Digital Engineering to Create Rich Experiences
What if intelligence wasn’t just applied—but engineered into everything you experience?
Join us at CES 2026, the world’s most influential technology event, from January 6–9 in Las Vegas, where innovation converges to shape the next frontier of connected living. With 4,500 exhibitors including 1400+ Startups, 300+ Fortune 500 companies, and 142,000+ attendees from 158 countries in 2025, CES is the ultimate stage for breakthroughs in AI, immersive experiences, and sustainable technologies that redefine how we live and work.
As a leading innovator, TCS will showcase how ‘Engineering the Future, Intelligent by Design’ is transforming industries and ecosystems. From autonomous mobility, intelligent electrification, Physical AI robotics, GenAI-led vehicle experiences and advanced semiconductor engineering, we are enabling enterprises to build smarter products, resilient operations, and sustainable experiences.
Meet us at Booth #6567, LVCC West Hall, and explore how we are shaping an intelligent, inclusive, and sustainable tomorrow.
Meet Our Leaders
Anupam Singhal
President - Manufacturing, TCS
With over three decades of experience, he has consistently demonstrated his commitment to customer success by driving digital transformations and formulating effective business strategies. His astute leadership has yielded multi-billion-dollar value to customers and expanded TCS' presence across diverse domains. Among Anupam’s notable accomplishments is the digital transformation of a marquee customer's legacy business, which resulted in TCS being awarded the 2016 Digital Innovator of the Year among the customer organization’s partner ecosystem. He has also contributed to TCS’ intellectual property with the IDEA Framework for Contextualized Touch and Believe Point of Views©.
Rakesh Devpura
Head - Manufacturing North America, TCS
Rakesh Devpura leads large conglomerate and diversified industries business unit at TCS. In this role, Rakesh is managing customer relationship and driving purpose-led business growth and transformation. With more than 23 years of technology and industry experience in manufacturing and financials, Rakesh believes in driving business outcome and innovative business model with strong digital core. His expertise involves handling complex business problems of large and diversified industries through agility, speed, innovation and digital transformation.
Naresh Mehta
Global Chief Technology Officer, Manufacturing, TCS
Naresh has close to 20 years of experience in the manufacturing industry. Naresh is responsible for defining an end-to-end transformation strategy, operating model, and Digital Solutions across subjects like AI, GenAI, CX, Design Thinking & UX, Cloud, Microservices & Application, Data & Analytics, Automation, IoT, Emerging Tech lines which includes Augmented Reality, Virtual Reality, Quantum Computing etc.
Subhash Sakorikar
Global Head, Industry Excellence, Manufacturing, TCS
Subhash is the Global Head, Industry Excellence & Advisory, Manufacturing, Tata Consultancy Services. Subhash oversees global business and technology transformation programs across the value chain of manufacturing business domains such as – new product Introductions, supply chain, manufacturing operations, and customer experience management. Over the last decade he has heavily focused on digital transformation and evolving new business models for its clients and technology driven transformation. At TCS, he has advised many leading clients in manufacturing and has contributed to various thought leadership journals, published a number of white papers on digital transformation. With over 30 years with TATA group companies, prior to TCS he has played various leadership roles at automotive business and as National Product Manager for Excavators & Backhoe Loaders managing new product launches. He has been deeply involved in product management, marketing, dealer selection and development, Sales and Service force development. Subhash is Graduate in Production Engineering, holds Post Graduate Diploma in Finance and Marketing Management from XLRI, Jamshedpur, and an advanced diploma Indo-German Production engineering. He is trained at Leadership Development program at Harvard Business School and serves on advisory council of George Washington University. He lives in Troy, MI with his wife and two daughters.
Laksh Parthasarathy
Global Head, Smart Mobility, Manufacturing, TCS
Laksh is the Global Business Head for Smart Mobility Group at TCS focusing on the Cross-Industry trends that are impacting the mobility ecosystem. With over 25 years of global experience as a thought leader in the automotive mobility industry, Laksh focuses on driving TCS Smart Mobility solutions in the Automotive CASE (Connected, Autonomous, Shared and Electric) and multi-modal mobility domains, to address the major challenges faced by the industry.
Ankush Mohla
Chief Technology Officer - Manufacturing NA, TCS
Ankush is the Head of Digital for a large conglomerate at TCS. Ankush’s aim is to help clients with their growth and transformation journeys leveraging the TCS Business 4.0 approach - putting digital technologies/practices around user experience, cloud, automation and IoT at the core of every organization, and enabling them to develop the agility they need to embrace risks and innovate rapidly. Ankush comes with over 20 years of variety of industry exposure. He is passionate about reimagining cross-industry value chains through the lens of business outcomes and customer journeys with a strong focus on continuous innovation. Ankush holds a bachelor’s degree in Engineering and has completed Data Science Business Analytics course.
Speaking Sessions and More
The Intelligence Shift Driving Future-Ready Mobility
In 2026, digital intelligence is emerging as the new competitive advantage for the global mobility ecosystem. Automakers, suppliers, and technology partners are no longer just connecting vehicles—they are creating cognitive enterprises that anticipate, adapt, and accelerate in an era of disruption.
This flagship benchmark study, launching at CES 2026, explores how AI, data, and digital ecosystems are converging to power Future-Ready Mobility. It connects TCS’s narratives on Future-Ready Manufacturing and Future-Ready eMobility, offering a unified perspective on how intelligence, collaboration, and transformation are reshaping the industry.
Featuring insights from TCS leaders and industry pioneers, this Twindex report defines the next stage of mobility:
- From connected vehicles to cognitive enterprises
- From automation to anticipation
- From efficiency to foresight
Discover how intelligence by design is redefining mobility—and why the future belongs to those who engineer it.
Where: Mobility Stage
When: January 6, 2026, Tuesday
Time: 2:20 PM PT
Speakers:
- Anupam Singhal, President - Manufacturing, TCS (Keynote)
- Dr. Bobby Mitra, President AI and CIO, Tata Electronics
- Barry Chapman, VP and GM U.S. Industries, Siemens Digital Industries Software
- Mike Geyer, Head of Digital Twins and Industrial Metaverse, NVIDIA
- Naresh Mehta, Global CTO - Manufacturing, TCS (Moderator)
The manufacturing industry stands at a pivotal inflection point, driven by the convergence of silicon, intelligence, and sustainability. This is not a gradual evolution, but a present imperative demanding a radical reinvention of the value chain. As AI and edge computing fuse with advanced chip architectures, technology emerges as the engine of growth—powering predictive factories, autonomous mobility, and hyper-connected supply chains.
Join us at the 65th TCS Forum at CES 2026 to explore how industry leaders are leveraging semiconductor innovation and AI-driven intelligence to create adaptive, and future-ready enterprises.
Where: Booth # 6567, LVCC West Hall
When: January 7, Wednesday
Time: 11.00 AM PT
Speakers:
- Puneet Sinha, Sr. Director, Global Head of Battery Industry, Siemens Digital Industries Software
- Laksh Parthasarathy, Global Business Head, Smart Mobility Group, Tata Consultancy Services
As manufacturing systems become more autonomous, connected, and intelligent, Physical AI is emerging as the next frontier—where AI moves beyond analytics and copilots to operate directly within the physical world. At CES 2026, TCS brings together industry perspectives to explore how sensing, simulation, decisioning, and execution converge across factories, assets, and supply networks. This conversation will examine how manufacturers are operationalizing Physical AI through digital twins, intelligent automation, and real-time orchestration—enabling adaptive operations, resilient production, and scalable human–machine collaboration. Attendees will gain a practical view into how ecosystem-driven innovation is translating advanced AI into measurable outcomes on the factory floor.
Accelerating software-defined vehicle (SDV) development, leveraging AWS Generative AI.
Speaker:
- Manoj C R, Head - Autonomous Driving & AI/Gen AI, Tata Consultancy Services
Where: AWS Theatre # 4099
When: January 8, Thursday
Time: 3.00 PM PT
As we witness a monumental shift from mechanical to software-driven vehicles, generative AI is at the forefront of this transformation, revolutionizing various aspects such as software development, testing, user experience, personalization, and safety.
TCS Manufacturing AI Canvas is an agentic AI platform that helps enterprises scale beyond isolated pilots to fully operationalize AI agents across diverse ecosystems. With pre-built “super agents” for manufacturing and industrial domains, the platform accelerates advanced workflows like Autonomous Supply Chain, Intelligent Procurement, Predictive Maintenance, and Operations Planning—delivering rapid value creation without compromising control.
Future-Ready Mobility
The future of mobility is being redefined through intelligent, connected, and sustainable innovations. From Physical AI-powered quadruped robots that autonomously monitor construction sites and warehouses to GenAI-driven Mobility AI solutions delivering hyper-personalized in-vehicle experiences, these demos showcase how technology is transforming transportation. Cutting-edge advancements like autonomous driving frameworks, radar-based gesture recognition, and in-cabin sensing are setting new benchmarks for safety and convenience. Showcases such as Vehicle Electrification modules and Automotive GenAI on edge platforms further accelerate the shift toward smarter, cleaner, and more immersive mobility ecosystems. Together, these innovations pave the way for a world where vehicles are not just modes of transport but intelligent companions in a connected future.
Factories of the Future
Manufacturing is evolving into intelligent ecosystems powered by AI, automation, and immersive technologies. Demos such as NVIDIA Omniverse-driven digital twins enable robotic arms to autonomously inspect and sort components with human-like perception, transforming static automation into adaptive decision-making. The Physical AI Blueprint brings safety and operational intelligence to the shop floor through quadruped robots equipped with advanced sensors and edge processing capabilities. Complementing these innovations, computer vision platforms deliver actionable insights that boost productivity and enhance customer experiences—ranging from logistics automation to advanced applications like facial heart-rate estimation. Together, these demos showcase how next-generation factories will combine robotics, AI, and vision technologies to achieve unprecedented agility, efficiency, and resilience.
Chips to Systems
From silicon to software, these demos showcase how advanced engineering is shaping the next generation of intelligent systems. Solutions like the Central Compute Module (CCM) deliver high-performance computing for Software-Defined Vehicles, while the Automotive Cockpit Solution Suite integrates voice assistants with onboard large language models for seamless in-vehicle experiences. In semiconductors, innovations such as the UCIe Verification Framework and Advanced Package Design services accelerate chiplet-based product development with superior performance and reliability. Complementing these are AI-driven platforms like TCS AI Model Optimizer for edge devices and NeurEDA for optimizing complex EDA workloads across hybrid environments. Together, these breakthroughs—from predictive maintenance and software-defined inspection to WaferWise for yield optimization—demonstrate how TCS is enabling a connected ecosystem where chips, systems, and AI converge to power the future.
Design to Device
Bridging the gap between concept and creation, these demos highlight TCS’s capabilities in delivering precision-engineered solutions from semiconductor design to finished products. At the OSAT facility, advanced packaging technologies such as FCCSP, BGA, QFP, and DFN enable the development of robust, high-performance chip packages tailored for next-generation electronics. Complementing this, the EMS facilities showcase expertise in precision manufacturing—from 3D profile matching and die inserts to smartphone enclosures—leveraging advanced machining and molding techniques. Together, these capabilities demonstrate how TCS transforms innovative designs into reliable, scalable devices, accelerating time-to-market and ensuring uncompromised quality across industries.