May 5–7, 2026, Malaysia International Trade and Exhibition Centre (MITEC), Kuala Lumpur, Malaysia
SEMICON Southeast Asia 2026
TCS proudly participates in SEMICON Southeast Asia 2026 as an exhibitor at Booth #3178.
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At TCS, we don’t just help businesses transform. We help them become perpetually adaptive enterprises, built to evolve continuously and confidently in a world of constant change.
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11 May 2026
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07 May 2026
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High Tech Solutions to Drive Business Transformation through Technology
Read how the technology industry can help drive business transformation and digital innovation and build a supply chain for the industries they serve.
Related Insights
Join us at SEMICON Southeast Asia 2026 to explore how our innovations power AI-infused VLSI design, chiplet architecture, and silicon to systems engineering.
Events
15 Apr 2026
Talent intelligence transforms HR systems through digital agents, skills insights, and workforce orchestration, driving productivity and smarter decisions.
White Paper
14 Apr 2026
From intelligent automation to bug prediction, learn how AI/ML adoption in semiconductor design verification enables faster cycles and higher quality.
White Paper
16 Mar 2026
Chip to systems: Engineering the future of semiconductors.
The semiconductor industry is at a pivotal inflection point, driven by increasing design complexity, advanced nodes, and the shift toward intelligent, connected systems. As enterprises embrace chiplet architectures, advanced packaging, and smart manufacturing, the need for integrated, end-to-end engineering capabilities has never been greater.
Tata Consultancy Services stands at the forefront of this transformation—helping semiconductor enterprises reimagine the journey from silicon to systems through AI-led engineering and intelligent operations.
TCS is pleased to participate in SEMICON Southeast Asia 2026, scheduled from May 5–7, 2026, at Kuala Lumpur, Malaysia.
Our theme:
Chip to systems: Engineering the future of semiconductors.
Exclusive demo showcase at Booth #3178
Experience TCS’ cutting-edge innovations first-hand:
- AI-infused VLSI design: Enhancing productivity, reducing design cycles, and improving accuracy.
- Advanced packaging and chiplet engineering: Enabling scalable, high-performance architectures.
- AI-led fab and OSAT manufacturing: Driving yield optimisation, predictive operations, and factory intelligence.
- End-to-end silicon to systems engineering: Bridging chip design with system-level innovation.
We would be delighted to schedule a meeting for you with our experts during the event.
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