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Highlights
- Chiplet security establishes hardware-rooted trust across heterogeneous, multi-vendor semiconductor systems supporting AI, high-performance computing (HPC), automotive, cloud and edge workloads.
- Expanded chiplet attack surfaces expose organisations to supply-chain tampering, untrusted silicon, side-channel attacks, runtime compromise and post-quantum threats.
- Hardware roots of trust, Device Identifier Composition Engine (DICE) and Security Protocol and Data Model (SPDM) attestation, secure UCIe communication, runtime verification and crypto-agile architectures underpin trusted chiplet ecosystems.
- TCS secures the chiplet lifecycle through secure-by-design architecture, attestation, protected die-to-die communication, side-channel validation and compliance orchestration.
- This approach reduces security and certification risk, accelerates trusted partner onboarding and time-to-market, and prepares organisations for Zero Trust and post-quantum requirements.
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Chiplet Security
Chiplet security and attestation provide the trust foundation for heterogeneous semiconductor systems built from multiple dies sourced from different vendors. As AI accelerators, HPC systems, automotive platforms, and edge devices increasingly adopt chiplet-based architectures connected through standards such as UCIe 3.0, organisations must establish silicon-level trust across every chiplet.
Chiplet security combines hardware roots of trust, secure boot, cryptographic identity, attestation services, and protected die-to-die communication to ensure authenticity, integrity, and runtime trust. These capabilities help protect semiconductor systems from supply-chain compromise, side-channel attacks, firmware tampering, and future quantum-era threats.
Key Challenges
Why is chiplet security and attestation necessary?
The transition to multi-vendor chiplet ecosystems significantly expands the hardware attack surface.
Key challenges include:
- Supply-chain tampering and counterfeit chiplets.
- Hardware Trojans introduced during fabrication or packaging.
- Untrusted third-party silicon IP.
- Attestation of independently sourced dies.
- High-speed die-to-die communication vulnerabilities.
- Runtime firmware compromise.
- Side-channel attacks targeting silicon assets.
- Trust propagation across heterogeneous chiplet fabrics.
- Post-quantum cryptographic vulnerabilities.
- Compliance demands from NIST, ISO/SAE 21434, EU AI Act, and emerging regulations.
Without verifiable trust across chiplet boundaries, organisations face increased security risk, prolonged certification cycles, and barriers to large-scale chiplet adoption.
Technology Trends
What technologies are defining the future of trusted chiplet systems?
The semiconductor industry is converging around several foundational security technologies:
- Hardware Roots of Trust (RoT) embedded within chiplets.
- DICE-based identity frameworks for device-level trust establishment.
- SPDM-based attestation protocols supporting runtime verification.
- UCIe-secured die-to-die communication frameworks.
- Post-Quantum Cryptography using crypto-agile architectures.
- Secure enclaves and trusted execution environments.
- AI-driven anomaly detection at the chiplet level.
- Hardware-based confidential computing.
- Open attestation marketplaces for multi-vendor ecosystems.
- Zero Trust silicon architectures enabling continuous verification.
Industry leaders increasingly view chiplet attestation as a critical requirement for future high-performance semiconductor platforms.
TCS’ approach to secure chiplet integration and attestation.
TCS delivers a comprehensive strategy that secures the complete chiplet lifecycle.
- Early-stage threat modelling.
- Security-centric chiplet co-design.
- Root of Trust placement strategy.
- Chiplet trust partitioning.
- Secure package architecture reviews.
- Secure chiplet identities.
- Cryptographic key protection.
- Secure boot enablement.
- Hardware trust establishment.
- Crypto-agile security architecture.
- DICE-based trust establishment.
- SPDM-based remote attestation.
- Multi-chiplet verification.
- Runtime integrity validation.
- Configuration state verification.
- UCIe security integration.
- Encrypted chiplet communication.
- Secure session establishment.
- Data confidentiality and integrity protection.
- Power analysis assessment.
- Timing attack evaluation.
- Electromagnetic leakage analysis.
- Fault injection testing.
- Formal security verification.
- NIST alignment.
- ISO/SAE 21434 readiness.
- EU AI Act support.
- Supplier qualification.
- Secure ecosystem onboarding.
These capabilities enable end-to-end trust across heterogeneous chiplet systems while reducing integration risk and certification effort.
Business impact
Organisations adopting TCS's chiplet security and attestation approach can achieve:
- Protection against supply-chain attacks and silicon tampering.
- Secure multi-vendor chiplet integration.
- Reduced runtime compromise risk.
- Secure Zero Trust semiconductor architectures.
- Accelerated regulatory compliance and certification.
- Post-quantum readiness.
- Reduced risk of IP theft.
- Faster onboarding of ecosystem partners.
- Increased confidence in AI and HPC deployments.
- Faster time-to-market for secure chiplet solutions.
Use cases
Secure attestation enables AI accelerators and disaggregated GPU/TPU architectures to verify chiplet integrity before participating in model training and inference workloads.
Multi-vendor ecosystems require verifiable trust across suppliers. Chiplet attestation allows organisations to securely integrate third-party silicon while maintaining compliance and operational assurance.
Chiplet-based ECUs utilise attestation and secure communication to support cybersecurity, functional safety, and regulatory compliance.
Continuous runtime verification enables trusted deployment of workloads across distributed cloud and edge environments.
Runtime integrity validation protects mission-critical devices operating in regulated sectors.
TCS Advantage
TCS combines semiconductor engineering, cybersecurity, compliance expertise, and silicon validation capabilities to deliver trusted chiplet ecosystems at scale.
Why TCS?
- Expertise spanning very-large-scale integration (VLSI), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), systems on chip (SoCs), and chiplet architectures.
- Proven secure chiplet integration methodology.
- Advanced attestation and verification capabilities.
- Deep experience with UCIe-based ecosystems.
- Post-quantum-ready security architecture design.
- End-to-end compliance acceleration services.
- Security integration throughout the semiconductor lifecycle.
- Extensive experience across AI, automotive, HPC, and edge platforms.
TCS helps organisations design, integrate, verify, and operate trusted chiplet ecosystems with confidence.
Conclusion
Chiplet security and attestation are rapidly evolving from optional security enhancements into foundational requirements for heterogeneous semiconductor systems. By 2028–2030, standardised chiplet attestation is expected to become a baseline capability for high-performance silicon platforms.
Organisations should:
- Embed chiplet security requirements into all new designs.
- Adopt hardware-rooted trust frameworks early.
- Implement DICE and SPDM-based attestation architectures.
- Secure multi-vendor chiplet ecosystems.
- Build crypto-agile and post-quantum-ready platforms.
- Align chiplet security initiatives with enterprise Zero Trust programmes.
- Partner with experienced providers for validation and ecosystem orchestration.
Secure chiplet ecosystems built on verifiable trust, remote attestation, and hardware-rooted security will become the foundation for trustworthy AI, HPC, automotive, cloud, and edge computing systems. TCS provides the expertise, capabilities, and services required to accelerate this transition and enable secure innovation in the chiplet era.